nichia sts-da1-3001a nichia corporation specifications for warm white led nt2l757drt-v1 pb-free reflow soldering application built-in esd protection device rohs compliant
nichia sts-da1-3001a 1 specifications (1) absolute maximum ratings item symbol absolute maximum rating unit forward current i f 150 ma pulse forward current i fp 300 ma allowable reverse current i r 85 ma power dissipation p d 1.02 w operating temperature t opr -40~100 c storage temperature t stg -40~100 c junction temperature t j 120 c * absolute maximum ratings at t s =25c. * i fp conditions with pulse width 10ms and duty cycle 10%. (2) initial electrical/optical characteristics item symbol condition typ max unit forward voltage v f i f =75ma 6.05 - v luminous flux v i f =75ma 66.1 - lm luminous intensity i v i f =75ma 21.8 - cd r70 color rendering index r a i f =75ma 73 - - luminous flux v i f =75ma 63.6 - lm luminous intensity i v i f =75ma 21.1 - cd r8000 color rendering index r a i f =75ma 83 - - x - i f =75ma 0.41 - - chromaticity coordinate y - i f =75ma 0.39 - - thermal resistance r js - 12 18 c/w * characteristics at t s =25c. * luminous flux value as per cie 127:2007 standard. * chromaticity coordinates as per cie 1931 chromaticity chart. * r js is thermal resistance from junction to t s measuring point.
nichia sts-da1-3001a 2 ranks item rank min max unit forward voltage - 5.4 6.8 v p16 72.0 85.6 p15 60.5 72.0 p14 51.0 60.5 luminous flux p13 42.8 51.0 lm r70 r a 70 - - r a 80 - - color rendering index r8000 r 9 0 - - color ranks rank sw27 rank sw30 x 0.4373 0.4562 0.4813 0.4593 x 0.4147 0.4299 0.4562 0.4373 y 0.3893 0.4260 0.4319 0.3944 y 0.3814 0.4165 0.4260 0.3893 rank sw35 rank sw40 x 0.3898 0.3996 0.4299 0.4147 x 0.3670 0.3736 0.3996 0.3898 y 0.3716 0.4015 0.4165 0.3814 y 0.3578 0.3874 0.4015 0.3716 rank sw45 x 0.3515 0.3548 0.3736 0.3670 y 0.3487 0.3736 0.3874 0.3578 * ranking at t s =25c. * forward voltage tolerance: 0.07v * luminous flux tolerance: 5% * color rendering index r a toleranc e: 2 * color rendering index r 9 toleranc e: 4 * the r 9 value for the above rank shall be greater than 0. * chromaticity coordinate tolerance: 0.003 * leds from the above ranks will be shipped. the rank combination ratio per sh ipment will be decided by nichia. luminous flux ranks by color ra nk, color rendering index rank ranking by luminous flux ranking by color coordinates, color rendering index p13 p14 p15 p16 r70 sw27 r8000 sw30,sw35,sw40,sw45 r70,r8000
nichia sts-da1-3001a 3 chromaticity diagram sw27 sw30 sw35 sw40 sw45 0.30 0.35 0.40 0.45 0.50 0.30 0.35 0.40 0.45 0.50 x y \?E blackbody locus 2580k 4745k 4260k 3710k 3220k 2870k
nichia sts-da1-3001a 4 outline dimensions sts-da7-5454 nt2x757dr-v1 ? no. ( g unit: mm) this product complies with rohs directive. u? rohs ?m??? * ( g unit: mm, tolerance: 0.2) 1.42 2.27 cathode anode 0.48 2.6 cathode mark 3 3 2.6 2.6 0.52 dimensions do not include mold flash. ?????? * ka o protection device ? item ??`| package materials ??| encapsulating resin materials ?O| electrodes materials | weight description ????` heat-resistant polymer ?`? ? + w silicone resin (with diffuser and phosphor) 0.018g(typ) y? ag-plated
nichia sts-da1-3001a 5 soldering ? recommended reflow soldering condition(lead-free solder) ? recommended hand soldering condition temperature 350c max soldering time 3sec max recommended soldering pad pattern recommended metal solder stencil aperture ( g unit: mm) 0.6 1.45 0.95 0.6 0.85 2.3 0.85 0.4 2 2.3 3.15 0.6 1.53 0.69 0.6 0.58 2.3 3.15 * this led is designed to be reflow soldered on to a pc b. if dip soldered, nichia cannot guarantee its reliability. * reflow soldering must not be performed more than twic e. hand soldering must not be performed more than once. * avoid rapid cooling. ramp down the temper ature gradually from th e peak temperature. * nitrogen reflow soldering is recommended. air flow soldering conditions can cause optical degradation, caused by heat and/or atmosphere. * since the silicone used in the encapsulating resin is soft, do not press on the encapsulant resin. pressure can cause nicks, chip-outs, encapsulant delaminati on and deformation, and wire br eaks, decreasing reliability. * repairing should not be done after the leds ha ve been soldered. when repairing is unavoidable, a double-head soldering iron should be used. it should be confirmed beforehand whether the characteri stics of the leds will or will not be damaged by repairing. * when soldering, do not apply stre ss to the led while the led is hot. * when using a pick and place machine, choose an appropriate nozzle for this product. using a pick-and-place nozzle with a smaller diameter than the size of the led's em itting surface will cause damage to the emitting surface and may also cause the led not to illuminate. * the recommended soldering pad pattern is design ed for attachment of the led without problems. when precise mounting accuracy is required, such as high-density mounting, ensure that the size and shape of the pad are suitable for the circuit design. * consider factors such as the reflow soldering temperature, hand soldering temperature, etc. when choosing the solder. * when flux is used, it should be a ha logen free flux. ensure that the manufacturing process is not designed in a manner where the flux will come in contact with the leds. * make sure that there are no issues with the type and amount of solder that is being used. * all of the electrode pads are on the backside of this produc t; solder connections will not be able to be seen nor confirmed by a normal visual inspection. when using the product, ensure that there are no issues with the soldering conditions. 120sec max pre-heat 180 to 200c 260cmax 10sec max 60sec max above 220c 1 to 5c per sec
nichia sts-da1-3001a 6 tape and reel dimensions sts-da7-4266 nxxx757x ?` / ` trailer and leader top cover tape led ?? ` 400mm ?` 160mm ? trailer 160mm min(empty pockets) loaded pockets ???` embossed carrier tape ???`?` feed direction leader without top cover tape 400mm min 100mm ? leader with top cover tape 100mm min(empty pocket) ? no. ( g unit: mm) cathode mark 60 +1 -0 `? reel f 1 3 0 . 2 f 2 1 0 . 8 ? label 2 1 0 . 8 1 3 0 . 2 11.4 1 9 0.3 180 +0 -3 -0 1.5 +0.1 ?`??? tape 4 0.1 1.75 0.1 4 0.1 2 0.05 3.5 0.05 8 +0.3 -0.1 0.2 0.05 0.7 0.1 3.18 0.1 3.18 0.1 -0 1 +0.2 reel size: 5000pcs 1 `?? 5000 ? * the tape packing method complies with jis c 0806 (packaging of electronic components on continuous tapes). * jis c 0806 ???`??????? when the tape is rewound due to work interruptions, no more than 10n should be applied to the embossed carrier tape. the leds may stick to the top cover tape. * g?I???????`?`?? ???`??? (10n ) ? led `?`?N???
nichia sts-da1-3001a 7 packaging - tape & reel nichia led sts-da7-4989 nxxxxxxx ? label ? label ? no. reel ` ?` seal moisture-proof bag ?? rohs nxxxxxxx xxxx led ******* nichia corporation 491 oka, kaminaka, anan, tokushima, japan type lot qty. ymxxxx-rrr pcs rohs nxxxxxxx xxxx led ******* rrr pcs type rank qty. nichia corporation 491 oka, kaminaka, anan, tokushima, japan reels are shipped with desiccants in heat-seale d moisture-proof bags. ????`???? ?`???? desiccants ? moisture-proof bags are packed in cardboard boxes with corrugated partitions. ??K? ?`? ?`?????? y?????? * ? \H?y?B???y? * ?QH n???? u?p?????? * using the original package material or equivalent in transit is recommended. do not expose to water. the box is not water-resistant. do not drop or expose the box to extern al forces as it may damage the products. products shipped on tape and reel are packed in a moisture-proof bag. they are shipped in cardboard boxes to protect th em from external forces during transportation. * u???`??? ??n?go??`y? if not provided, it will not be indicated on the label. ******* is the customer part number. O??????? * ******* ? ?? ? for details, see "lot numbering code" in this document. * ??????????? the label does not have the rank field for un-ranked products. * ???????????
nichia sts-da1-3001a 8 lot numbering code lot number is presented by using the following alphanumeric code. ymxxxx - rrr y - year year y 2013 d 2014 e 2015 f 2016 g 2017 h 2018 i m - month month m month m 1 1 7 7 2 2 8 8 3 3 9 9 4 4 10 a 5 5 11 b 6 6 12 c xxxx-nichia's product number rrr-ranking by color coordinates, ranking by luminous flux, ranking by color rendering index
nichia sts-da1-3001a 9 derating characteristics nt2x757dr-v1 ? no. sts-da7-5455 derating1 0 50 100 150 200 250 300 0 20 40 60 80 100 120 (48, 150) (100, 42.0) derating2 0 50 100 150 200 250 300 0 20 40 60 80 100 120 (100, 150) duty 10 100 1000 1 10 100 150 300 S allowable forward current ( ma ) ????(`?)-S solder temperature(cathode side) vs allowable forward current ??-S ambient temperature vs allowable forward current S allowable forward current(ma) S allowable forward current(ma) ????(`?) solder temperature(cathode side)(c) ?? ambient temperature(c) ?`?` duty ratio(%) ?`?`-S duty ratio vs allowable forward current 74c/w ja r = t a =25c
nichia sts-da1-3001a 10 optical characteristics NT2L757DR-V1 ? no. sts-da7-5567 spectrum 0.0 0.2 0.4 0.6 0.8 1.0 400 450 500 550 600 650 700 750 800 ? relative illuminance(a.u.) directivity1 90 80 70 60 50 40 30 20 10 0 -10 -20 -30 -40 -50 -60 -70 -80 -90 k??? spectrum k? relative emission intensity(a.u.) L wavelength(nm) ? directivity ? radiation angle 1 0.5 0 0.5 1 a 75ma i f = t =25c 75ma i fp = t a =25c * ??? r70 ???? the graphs above show the characteristics for r70 leds of this product. * ??? all characteristics shown are for refe rence only and are not guaranteed.
nichia sts-da1-3001a 11 optical characteristics NT2L757DR-V1 ? no. sts-da7-5568 spectrum 0.0 0.2 0.4 0.6 0.8 1.0 400 450 500 550 600 650 700 750 800 ? relative illuminance(a.u.) directivity1 90 80 70 60 50 40 30 20 10 0 -10 -20 -30 -40 -50 -60 -70 -80 -90 k??? spectrum k? relative emission intensity(a.u.) L wavelength(nm) ? directivity ? radiation angle 1 0.5 0 0.5 1 a 75ma i f = t =25c 75ma i fp = t a =25c * ??? r8000 ???? the graphs above show the characteristics for r8000 leds of this product. * ??? all characteristics shown are for refe rence only and are not guaranteed.
nichia sts-da1-3001a 12 forward current characteristics / temperature characteristics nt2x757dr-v1 ? no. sts-da7-5461 tavf 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 -60 -40 -20 0 20 40 60 80 100 120 taiv 0.6 0.8 1.0 1.2 1.4 -60 -40 -20 0 20 40 60 80 100 120 vfif 10 100 1000 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 75 300 relative luminous flux(a.u.) ??- ambient temperature vs relative luminous flux forward current(ma) ifiv 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 0 100 200 300 400 relative luminous flux(a.u.) - forward current vs relative luminous flux forward current(ma) ?R- forward voltage vs forward current ??-?R ambient temperature vs forward voltage ?R forward volta g e ( v ) ?R forward voltage(v) ?? ambient tem p erature ( c ) ?? ambient temperature(c) t a =25c * ??? all characteristics shown are for refe rence only and are not guaranteed. t a =25c i fp = 75ma i fp = 75ma
nichia sts-da1-3001a 13 forward current characteristics / temperature characteristics NT2L757DR-V1 ? no. sts-da7-5569 taxy 0.37 0.38 0.39 0.40 0.41 0.38 0.39 0.40 0.41 0.42 -40c 0c 25c 100c x ifxy 0.37 0.38 0.39 0.40 0.41 0.38 0.39 0.40 0.41 0.42 10ma 20ma 75ma 150ma 300ma x y y 75ma i fp = ??-? ambient temperature vs chromaticity coordinate -? forward current vs chromaticity coordinate t a =25c * ??? all characteristics shown are for refe rence only and are not guaranteed. * ??? r70 ???? the graphs above show the characteristics for r70 leds of this product.
nichia sts-da1-3001a 14 forward current characteristics / temperature characteristics NT2L757DR-V1 ? no. sts-da7-5570 taxy 0.37 0.38 0.39 0.40 0.41 0.38 0.39 0.40 0.41 0.42 -40c 0c 25c 100c x ifxy 0.37 0.38 0.39 0.40 0.41 0.38 0.39 0.40 0.41 0.42 10ma 75ma 300ma x y y 75ma i fp = ??-? ambient temperature vs chromaticity coordinate -? forward current vs chromaticity coordinate t a =25c * ??? all characteristics shown are for refe rence only and are not guaranteed. * ??? r8000 ???? the graphs above show the characteristics for r8000 leds of this product.
nichia sts-da1-3001a 15 reliability (1) tests and results te s t reference standard test conditions te s t duration failure criteria # units failed/tested resistance to soldering heat (reflow soldering) jeita ed-4701 300 301 t sld =260c, 10sec, 2reflows, precondition: 30c, 70%rh, 168hr #1 0/22 solderability (reflow soldering) jeita ed-4701 303 303a t sld =2455c, 5sec, lead-free solder(sn-3.0ag-0.5cu) #2 0/22 temperature cycle jeita ed-4701 100 105 -40c(30min)~25c(5min)~ 100c(30min)~25c(5min) 100cycles #1 0/50 moisture resistance (cyclic) jeita ed-4701 200 203 25c~65c~-10c, 90%rh, 24hr per cycle 10cycles #1 0/22 high temperature storage jeita ed-4701 200 201 t a =100c 1000hours #1 0/22 temperature humidity storage jeita ed-4701 100 103 t a =60c, rh=90% 1000hours #1 0/22 low temperature storage jeita ed-4701 200 202 t a =-40c 1000hours #1 0/22 room temperature operating life condition 1 t a =25c, i f =75ma test board: see notes below 1000hours #1 0/22 room temperature operating life condition 2 t a =25c, i f =150ma test board: see notes below 500hours #1 0/22 high temperature operating life t a =100c, i f =40ma test board: see notes below 1000hours #1 0/22 temperature humidity operating life 60c, rh=90%, i f =75ma test board: see notes below 500hours #1 0/22 low temperature operating life t a =-40c, i f =75ma test board: see notes below 1000hours #1 0/22 vibration jeita ed-4701 400 403 200m/s 2 , 100~2000~100hz, 4cycles, 4min, each x, y, z 48minutes #1 0/22 electrostatic discharges jeita ed-4701 300 304 hbm, 2kv, 1.5k ? , 100pf, 3pulses, alternately positi ve or negative #1 0/22 soldering joint shear strength jeita ed-4702b 002 3 5n, 101sec #1 0/22 notes: 1) test board: fr4 board thickness=1.6mm, copper layer thickness=0.07mm, r ja 74c/w 2) measurements are performed after allo wing the leds to return to room temperature. (2) failure criteria criteria # items conditions failure criteria forward voltage(v f ) i f =75ma >u.s.l.1.1 #1 luminous flux( v ) i f =75ma nichia sts-da1-3001a 16 cautions (1) storage conditions temperature humidity time before opening aluminum bag 30c 90%rh within 1 year from delivery date storage after opening aluminum bag 30c 70%rh 168hours baking 655c - 24hours product complies with jedec msl 3 or equivalent. se e ipc/jedec std-020 for moisture-sensitivity details. absorbed moisture in led packages can vaporize and expand during soldering, which can cause interface delamination and result in optical performance degradation. products are packed in moisture-proof aluminum bags to minimize moisture absorptio n during transportation and storage. included silica gel desiccants change from blue to red if moisture had penetrated bags. after opening the moisture-proof aluminum bag, the products should go through the soldering process within the range of the conditions stated above. unused remaining leds should be stored with silica gel desiccants in a hermetically sealed container, prefer ably the original moisture -proof bags for storage. after the ?period after opening? stor age time has been exceeded or silica gel desiccants are no longer blue, the products should be baked. baking should only be done once. customer is advised to keep the leds in an airtight cont ainer when not in use. exposu re to a corrosive environment may cause the plated metal parts of the product to tarnish, which could adversely affect so ldering and optical characteristi cs. it is also recommended to return the leds to the original moisture proof bags and reseal. after assembly and during use, silver plating can be affected by the corrosi ve gases emitted by components and materials in close proximity of the leds within an end product, and the gases entering into the product from the external atmosphere. the above should be taken into consideration when designing. resin materials, in particular, may contain substanc es which can affect silver plating, such as halogen. do not use sulfur-containing materials in commercial products. some materials, such as seals and adhesives, may contain sulfur . the extremely corroded or contaminated plating of leds might cause an open ci rcuit. silicone rubber is recommended as a material for seals. bear in mi nd, the use of silicones may lead to silico ne contamination of electrical contacts inside the products, caused by lo w molecular weight volatile siloxane. to prevent water condensation, please avoid large temperat ure and humidity fluctuations for the storage conditions. do not store the leds in a dusty environment. do not expose the leds to direct sunlight and/or an environment where the temperature is higher than normal room temperature. (2) directions for use when designing a circuit, the current through each led must not exceed the absolute maximum rating. operating at a constant current per led is recommended. in case of operating at a constant voltage, circuit b is recommended . if the leds are operated with constant voltage using circui t a, the current through the leds may vary due to the variation in forward voltage ch aracteristics of the leds. (a) ... (b) ... this product should be operated using forward curre nt. ensure that the product is not subjected to either forward or reverse voltage while it is not in use. in particular, subjecting it to continuous reverse voltage may cause migration, which may cause damage to the led die. when used in displays that are not used for a long time, the main power supply should be switched off for safety. it is recommended to operate the leds at a current greater than 10% of the sorting current to stabilize the led characteristic s. ensure that excessive voltages such as lightning surges are not applied to the leds. for outdoor use, necessary measures should be taken to prevent water, moisture and salt air damage.
nichia sts-da1-3001a 17 (3) handling precautions do not handle the leds with bare hands as it will contaminat e the led surface and may affect the optical characteristics: it might cause the led to be deformed and/or the wi re to break, which will cause the led not to illuminate. when handling the product with tweezers, be ca reful not to apply excessive force to the resin. otherwise, the resin can be cut, ch ipped, delaminate or deform ed, causing wire-bond breaks and catastrophic failures. dropping the prod uct may cause damage. do not stack assembled pcbs together. fa ilure to comply can cause the resin portio n of the product to be cut, chipped, delaminated and/or deformed. it may cause wi re to break, leading to catastrophic failures. (4) design consideration pcb warpage after mounting the products on to a pcb can cause the package to break. the led should be placed in a way to minimize the stress on the leds due to pcb bow and twist. the position and orientation of the leds affect how much mechan ical stress is exerted on the le ds placed near the score lines. the led should be placed in a way to minimi ze the stress on the leds due to board flexing. board separation must be performed using special jigs, not using hands. volatile organic compounds that have been released from materials present around the le ds (e.g. housing, packing, adhesive, secondary lens, lens cover, etc.) may penetrate the led lens and/ or encapsulating resin. if the leds are being used in a hermetically sealed enviro nment, these volatile compounds ca n discolor after being exposed to heat and/or photon energy and it may greatly re duce the led light output and/or cause a color shift. in this case, ventilating the environment may improve the reduction in light output and/or color shift. perform a light-up test of the ch osen application for optical evaluation to ensure that there are no issues, especially if the leds are planned to be used in a hermetically sealed environment. (5) electrostatic discharge (esd) the products are sensitive to static electricity or su rge voltage. esd can damage a die and its reliability. when handling the products, the following measures against electrostatic discharge are strongly recommended: eliminating the charge grounded wrist strap, esd footwear, clothes, and floors grounded workstation equipment and tools esd table/shelf mat made of conductive materials ensure that tools (e.g. soldering ir ons), jigs and machines that are bein g used are properly grounded and that proper grounding techniques are used in wo rk areas. for devices/equipment that mount the leds, protection against surge vo ltages should also be used. if tools or equipment contain insulating materials such as glass or plastic, the following measures against electros tatic discharge are st rongly recommended: dissipating static charge with conductive materials preventing charge generation with moisture neutralizing the charge with ionizers the customer is advised to chec k if the leds are damaged by esd when performing the characteristics in spection of the leds in the application. damage can be detected with a forward voltage measurement or a light-up test at low current ( 1ma). esd damaged leds may have current flow at a low voltage or no longer illuminate at a low current. failure criteria: v f <4.0v at i f =0.5ma
nichia sts-da1-3001a 18 (6) thermal management proper thermal management is an impo rtant when designing produc ts with leds. led die temperature is affected by pcb thermal resistance and led spacing on the board. please design products in a way that the led die temperature does not exceed the maximum junction temperature (t j ). drive current should be determined for the surrounding ambient temperature (t a ) to dissipate the heat from the product. the following equations can be used to calculate the junction temperature of the products. 1) t j =t a +r ja ? w 2) t j =t s +r js ? w *t j =led junction temperature: c t a =ambient temperature: c t s =soldering temperature (cathode side): c r ja =thermal resistance from junction to ambient: c/w r js =thermal resistance from junction to t s measuring point: c/w w=input power(i f v f ): w ts point (7) cleaning the leds should not be cleaned with water, benzine, and/or thinner. if required, isopropyl alcohol (ipa) should be used. ot her solvents may cause premature failure to the leds due to the damage to the resin portion. the effects of such solvents should be verified prior to use. in addition, the use of cfcs such as freon is heavily regulated. when dust and/or dirt adheres to the leds , soak a cloth with isopropyl alcohol (ipa), then squeeze it before wiping the leds. ultrasonic cleaning is not recommended since it may have adverse effects on the leds depending on the ultrasonic power and how led is assembled. if ultrasonic cleaning must be used, the customer is advised to make sure the leds will not be damaged prior to cleaning. (8) eye safety in 2006, the international electrical commission (iec ) published iec 62471:2006 photobiological safety of lamps and lamp systems, which added leds in its scope. on the other hand, the iec 60825-1:2007 laser safety standard removed leds from its scope. however, please be advised that some countries and regions ha ve adopted standards based on the iec laser safety standard iec 60825-1: 20112001, which still includes leds in its scope. most of nichia's leds can be classified as belo nging into either the exempt group or risk group 1. high-power leds, that emit ligh t containing blue wavelengths, may be classified as risk group 2. please proceed with caution when viewing directly any leds driven at high current, or viewing leds with optical instruments which may greatly increase the damages to your eyes. viewing a flashing light may cause eye discomfort. when incorporating the led into your product, please be careful to avoid adverse effects on the human body caused by light stimulation.
nichia sts-da1-3001a 19 (9) others the leds described in this brochure are intended to be used for ordinary electronic equipmen t (such as office equipment, communications equipment, measurement instruments and household appliances). consult nichia's sales staff in advance for information on the applicat ions in which exceptional quality and reliability are required, particularly when the failure or malfunction of the leds may directly jeopardize life or health (such as for airplanes, aerospace, submersibl e repeaters, nuc lear reactor control system, automobiles, traffic control equipment, life support systems and safety devices). the customer shall not reverse engineer by disassembling or analysis of the leds without having prior written consent from nichia. when defective leds are found, the customer shall inform nichia directly before disassembling or analysis. the specifications and appearance of th is product may change without notice; nichia does not guarantee the contents of this specification. both the customer and nichia will agree on the official specifications of supplied products before the volume production of a program begins.
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